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High Frequency PCB Built on RO4003C 32 mil Substrate

Shenzhen Bicheng Electronics Technology Co., Ltd.

High Frequency PCB Built on RO4003C 32 mil Substrate

Country/Region china

Company Shenzhen Bicheng Electronics Technology Co., Ltd.

Categories High frequency PCB

Update 2021-01-15 22:21:37

ICP License Issued by the Chinese Ministry

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High Frequency PCB Built on RO4003C 32 mil Substrate
1.1 General description
This is a type of high frequency PCB built on RO4003C for the application of multicoupler. It's a 2 layer RF PCB board at 0.9 mm thick. It's HASL finish with solder mask and silkscreen from Taiyo. It's fabricated per IPC 6012 Class 2 using supplied Gerber data. Each 10 boards are packed for shipment.
1.2 Features and benifits
Excellent high frequency performance due to low dielectric tolerance and loss.
Stable electrical coefficient of dielectric constant.
Excellent dimensional stability.
Gold has high solderability, no stressing of circuit boards and less contamination of PCB surface.
High voltage test, Impedance control test, micro-section, solder-ability test,
thermal stress test, reliability test, insulation resistance test and ionic contamination test,
No MOQ, low cost for prototypes and samples.
More than 15 years' experience
Delivery on time: >98%
1.3 Application
LNA, VHF radio, Optoelectronic Transmitters, Tower Mounted Amplifier
1.4 Parameter and data sheet
BaseMaterial:RO4003C 32 mil (0.813 mm)
Copper Weight:1 oz each layer
Board Thickness:0.9 mm ±10%
Layer Count:2 layers
Board Size:98 x 72 mm =1up
Solder Mask:Green solder mask | white silkscreen
Surface Finish:HASL lead free
Via:via tented
Warpage:<0.75%
Net Weight:0.08 kg/pcs
Acceptable Standard:IPC-Class-2
Lead time for prototype:10 working days
Shelflife:6 months

Product Tags:

flex pcb thickness

      
China High Frequency PCB Built on RO4003C 32 mil Substrate

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