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Impedance Control Via in Pad Plated over Chemical Gold Cross Blind Buried Hole PCB

Impedance Control Via in Pad Plated over Chemical Gold Cross Blind Buried Hole PCB

Country/Region china

Company Jarnis Technology Co., Ltd.

Categories Impedance Controlled PCB

Update 2017-01-09 17:38:01

ICP License Issued by the Chinese Ministry

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Impedance Control Via in Pad Plated over Chemical Gold Cross Blind Buried Hole PCB
Basic Electronic Parameter:
Board Fabrication: FR4
Board Thickness: 1.6MM
Layer: 6-Layer
Finished Copper Size: Inner & external 1OZ
Min. Line Width: 5Mil
Min. Line Space: 6Mil
Min. Hole Diameter: 0.2MM
Soldermask: Green
Silkscreen: White
Surface Process: Immersion Gold

Product Tags:

blind buried vias pcb

      

blind buried vias

      

buried vias pcb

      
China Impedance Control Via in Pad Plated over Chemical Gold Cross Blind Buried Hole PCB

Impedance Control Via in Pad Plated over Chemical Gold Cross Blind Buried Hole PCB Images

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