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Impedance Control Via in Pad Plated over Chemical Gold Cross Blind Buried Hole PCB

Country/Region china
Company Jarnis Technology Co., Ltd.
Categories Impedance Controlled PCB
Telephone +86-755-23034656
ICP License Issued by the Chinese Ministry
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    Impedance Control Via in Pad Plated over Chemical Gold Cross Blind Buried Hole PCB

    Impedance Control Via in Pad Plated over Chemical Gold Cross Blind Buried Hole PCB
    Basic Electronic Parameter:
    Board Fabrication: FR4
    Board Thickness: 1.6MM
    Layer: 6-Layer
    Finished Copper Size: Inner & external 1OZ
    Min. Line Width: 5Mil
    Min. Line Space: 6Mil
    Min. Hole Diameter: 0.2MM
    Soldermask: Green
    Silkscreen: White
    Surface Process: Immersion Gold
    Quality Impedance Control Via in Pad Plated over Chemical Gold Cross Blind Buried Hole PCB for sale
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