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FR4 TG150 6 Layer 0.6MM HDI Printed Circuit Boards

Categories HDI PCB Board
Brand Name: WITGAIN PCB
Model Number: S06EO4734A0
Certification: UL Certificate
Place of Origin: China
MOQ: negotiable
Price: negotiable
Payment Terms: T/T
Supply Ability: 1kkpcs/month
Delivery Time: 20 work days
Packaging Details: 120pcs/bag, 20bags/carton
Material: FR4 , TG150
Layer Count: 6 Layer
Board Thickness: 0.6MM
Surface Treatment: ENIG+OSP
Solder Mask: Black
Silkscreen: White
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    FR4 TG150 6 Layer 0.6MM HDI Printed Circuit Boards


    6 Layer Printed Circuit Board With Blind And Buried Holes


    PCB Specifications:


    Layer Count: 6Layer HDI PCB

    Board Thickness: 0.6MM

    Material: FR4 TG150

    Holes: L1-L2 0.1MM, L2-L5 0.15MM, L5-L6 0.1MM, L1-L6 0.5MM

    Min Line: 3.5/2.8 Mil

    BGA Size: 12Mil

    Unit Size: 113.42MM*92.88MM/6UP

    Blind Holes: L1-L2 , L5-L6 0.1MM

    Buried Holes: L2-L5 0.13MM

    Solder Mask: Black

    Surface Treatment: ENIG+OSP

    Application: Mobile Phone Charging Board


    Our Manufacturing Capabilities:


    NOItemCapability
    1Layer Count1-24 Layers
    2Board Thickness0.1mm-6.0mm
    3Finished Board Max Size700mm*800mm
    4Finished Board Thickness Tolerance+/-10% +/-0.1(<1.0mm)
    5Warp<0.7%
    6Major CCL BrandKB/NanYa/ITEQ/ShengYi/Rogers Etc
    7Material TypeFR4,CEM-1,CEM-3,Aluminum,Copper, Ceramic, PI, PET
    8Drill Hole Diameter0.1mm-6.5mm
    9Out Layer Copper Thickness1/2OZ-8OZ
    10Inner Layer Copper Thickness1/3OZ-6OZ
    11Aspect Ratio10:1
    12PTH Hole Tolerance+/-3mil
    13NPTH Hole Tolerance+/-1mil
    14Copper Thickness of PTH Wall>10mil(25um)
    15Line Width And Space2/2mil
    16Min Solder Mask Bridge2.5mil
    17Solder Mask Alignment Tolerance+/-2mil
    18Dimension Tolerance+/-4mil
    19Max Gold Thickness200u'(0.2mil)
    20Thermal Shock288℃, 10s, 3 times
    21Impedance Control+/-10%
    22Test CapabilityPAD Size min 0.1mm
    23Min BGA7mil
    24Surface TreatmentOSP, ENIG,HASL, Plating Gold, Carbon Oil,Peelable Mask etc



    FAQ:


    Question: What are solder beads? How are they formed?

    Answer:

    Solder Beads are balls of solder that are created when soldering components on a PCB. They are created due to the use of excessive solder paste when soldering components on a board. Solder beads can cause a short circuit between the component terminals which can result in failure of the circuit. Also, in case there are vibrations, the solder ball can break loose and cause a short circuit somewhere else on the PCB. This is an undesirable phenomenon or defect in SMT (Surface Mount Technology).

    Due to the solder beads, there may be a chance of occurrence of an electrical short circuit between terminals of chip resistors or capacitors or ICs where it was formed. Also, if any vibration in PCB due to any reason, there may be a chance of the solder bead to break loose and move across PCB and make short circuits anywhere on the board. It is an undesirable phenomenon or defect in SMT.

    How does solder beading occur?

    The pads of PCB contain the solder paste. The required components (Chip Resistor, Capacitors or other IC) of a circuit are placed on the corresponding pads, and the PCB is sent into the reflow oven. In the reflow oven due to heat, the solder paste starts to melt-down. If there is excessive solder paste, some solder paste separates from the main solder paste on the pads and ends up underneath the component.

    Solder stuck underneath the component

    The solder stuck underneath the component does not return to solder pads and tends to form a ball of solder also known as a solder bead. During the cooling process, the surface tension of the cooling solder pulls the component closer to the pads. Here, the component is drawn down, towards the board and as a result the solder squeezes out on the side of the component in the form of a bead or ball.

    Solder bead squeezes out the side of the component and remains there

    How to prevent solder bead formation?

    Manual removal of solder removal is expensive and impractical. It is better to eliminate the solder beads before they occur. Since solder beading is usually caused by the use of excessive solder paste on the pads, the best solution would be to reduce the amount of solder paste being applied to the pads. This can be done by using the following ways:

    1. Increasing Stencil Thickness

    2. Modifying Aperture shape/size

    3. Changing viscosity of the Solder paste

    4. Adjusting the reflow profile

    5. Modifying the Squeegee speed and pressure

    What causes for Solder beading formation?

    Solder beading is caused by the use of excessive solder paste on the solder pads of a PCB. Other factors include the closeness of pads on a PCB, the shape of the pads, the reflow or melting profile used, and environmental conditions.

    Quality FR4 TG150 6 Layer 0.6MM HDI Printed Circuit Boards for sale
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