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10 Layers Nanya FR4 Communication PCB with immersion gold for pcb wifi antenna

Categories Communication PCB
Brand Name: ACCPCB
Model Number: P1116124
Certification: ISO, UL, SGS,TS16949
Place of Origin: China
MOQ: 10PCS
Price: Negotiable
Payment Terms: L/C / T/T / Western Union / Paypal
Supply Ability: 30,000SQ.M/Per Month
Delivery Time: 10-12days
Packaging Details: Vacuum packing with desiccant
Material: Nanya FR4
Thickness: 1.30mm
Surface Finish: Immersion gold
Layer: 10L
Copper thicknes:: 1.3 oz in each layer
PCB Standard: IPC-A-610 D
Type: customized PCB
Min Holes Size: 4mil
Min. Line Width: 4mil
Min Copper Thicness: 20um
Solder mask color: Green,yellow, red, black etc.
Application: LCD Monitor
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    10 Layers Nanya FR4 Communication PCB with immersion gold for pcb wifi antenna

    10 Layers Nanya FR4 Communication PCB with immersion gold for pcb wifi antenna


    Production Description :

    It is a multilayer PCB boards and used on LCD monitor production.all the products are Customized and must meet ISO9001 UL CE ROHS etc. certification with high quality sodering.


    Key Specifications of Impedance PCB:

    Production Types:Rigid PCB

    Layer :

    10Layers
    Base Material :NanyaFR4
    Copper Thickness :1.2 oz
    Board Thickness :1.3mm
    Min. Finish Hole Size :8 mil (0.10mm)
    Min. Line Width :4 mil
    Min. Line Spacing :4 mil
    Surface Finishing :ENIG
    Drilling hole tolerance:+/-3 mil ( 0.075mm )
    Min Outline tolerance :+/-4 mil ( 0.10mm )
    Working panel size :max:1200mmX600mm (47'' X24'')
    Outline profile:Punching, Routing , CNC routing + V-cut
    Solder mask :LPI Solder mask, Peelable mask
    Solder Mask Color :Blue, black,yellow, matte green
    Certificate :UL, CQC, TS16949, ISO14000, ROHS
    Silkscreen color :White
    Twist and Bow :no more than 0.75 %

    PCB Flow Chart.pdf


    Products Application:

    1, Telecom Communication
    2, Consumer Electronics
    3, Security monitor
    4, Vehicle Electronices
    5, Smart Home
    6, Industrial controls
    7, Military & Defense​


    Rigid PCB Technical Capability:

    ItemsTechnical Capability
    Layers1-28 layersMin. line width/space4mil

    Max.board size (single&doule

    sided)

    600*1200mmMin.annular ring width: vias3mil
    Surface finish

    HAL lead free,gold flash

    Immersion silver,Immersion gold ,Immersion Sn,

    hard gold,OSP,ect

    Min.board thickness(multilayer)4layers:0.4mm;
    6layers:0.6mm;
    8layers:1.0mm;
    10layers:1.20mm
    Board materials

    FR-4; high Tg; high CTI; halogen free; high frequency(rogers,taconic,

    PTFE,nelcon,

    ISOLA,polyclad 370 HR); heavy copper,

    Metal base clade laminate

    Plating thickness (Technique:

    Immersion Ni/Au)

    Plating type: Imm Ni, Min./Max thickness:100/150U'' Plating type: Imm Au, Min./Max thickness:2/4U''
    Impedance control± 10%

    Distance between

    line to board edge

    Outline: 0.2mm

    V-CUT: 0.4mm

    Base copper thickness(Inner

    and outer layer)

    Min. thickness: 0.5 OZ Max.thickness: 6OZMin.hole size(board thickness ≥2mm)Aspect ratio≤16
    Finished copper thicknessOuter layers:
    Min.thickness 1 OZ,
    Max.thickness 10 OZ
    Inner layers:
    Min.thickness :0.5OZ,
    Max.thickness : 6 OZ
    Max.board thickness(single&doule sided)3.20mm

    Advantages:
    • Strict product liability, taking IPC-A-160 standard
    • Engineering pretreatment before production
    • Production process control (5Ms)
    • 100% E-test, 100% visual inspection, including IQC, IPQC, FQC, OQC
    • 100% AOI inspection, including X-ray, 3D microscope and ICT
    • High-voltage test, impedance control test
    • Micro section, soldering capacity, thermal stress test, shocking test
    • In-house PCB production
    • No minimum order quantity and free sample
    • Focus on low to medium volume production
    • Quick and on-time delivery


    FAQ :

    1. How do ACCPCB ensure quality?

    Our high quality standard is achieved with the following.

    1.1 The process is strictly controlled under ISO 9001:2008 standards.
    1.2 Extensive use of software in managing the production process
    1.3 State-of-art testing equipments and tools. E.g. Flying Probe,e-Testing, X-ray Inspection, AOI (Automated Optical Inspector) .
    1.4.Dedicated quality assurance team with failure case analysis process


    2. What kinds of boards can ACCPCB process?

    Common FR4, high-TG and halogen-free boards, Rogers, Arlon, Telfon, aluminum/copper-based boards, PI, etc.


    3. What data are needed for PCB production?

    PCB Gerber files with RS-274-X format.


    4. How many types of surface finish ACCPCB can do?

    ACCPCB has the full series of surface finish, such as: ENIG, OSP, LF-HASL, gold plating (soft/hard), immersion silver, Tin, silver plating, immersion tin plating, carbon ink and etc. .. OSP, ENIG, OSP + ENIG commonly used on the HDI, we usually recommend that you use a client or OSP OSP + ENIG if BGA PAD size less than 0.3 mm.


    6. How to you make the impedance calculation?

    The impedance control system is done using some test coupons, the SI6000 soft and the CITS 500s equipment.


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