Grey 1.5mm T Thermal Gap Filler , LED Module Heat Sinking Thermal Insulators Materials

Grey 1.5mm T Thermal Gap Filler , LED Module Heat Sinking Thermal Insulators Materials

The TIF860 is not only designed to take advantage of the gap heat transfer, to fill gaps, complete the heat transfer between heating and cooling parts, but also played insulation, damping, sealing and so on, to meet the equipment miniaturization and ultra-thin design Requirements, which is a highly technology and use, and the thickness of the wide range of applications, is also an excellent thermal conductivity filler material.

Features:

> Perfect heat sinking
> Good thermal conductive: 5 W/mK

> Naturally tacky needing no further adhesive coating
> Soft and Compressible for low stress applications
> Thcikness: 3mmT

Applications:

> LED TV and LED-lit lamps

> Automotive engine control units

> High speed mass storage drives
> Heat Sinking Housing at LED-lit BLU in LCD

> Micro heat pipe thermal solutions

> Telecommunication hardware
> Handheld portable electronics
> Semiconductor automated test equipment

> RDRAM memory modules

> Cooling components to the chassis of frame

0.060" (1.52mm)

Standard Sheets Sizes:

8" x 16"(203mm x 406mm) 16" x 18"(406mm x 457mm)
TIF™ series Individual die cut shapes can be supplied.

Peressure Sensitive Adhesive:

Request adhesive on one side with "A1" suffix.
Request adhesive on double side with "A2" suffix.

Reinforcement:

TIF™ series sheets type can add with fiberglass reinforced.

Dongguan Ziitek Electronical Material and Technology Ltd. provides product solutions to equipment product which generates too much heat affecting its high performance when using. Plus thermal products can control and manage heat to keep it cool to some extent.  

Ziitek D-U-N-S® Number: 656191068