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FR4 High TG F4B HDI 94v0 High Frequency PCB HDI Immersion Gold Board High Density Interconnect

Categories High Frequency PCB
Brand Name: XCE
Model Number: XCER-4
Certification: CE,ROHS, FCC,ISO9008
Place of Origin: China
MOQ: 1pcs
Price: negotiation
Payment Terms: T/T,Western union
Supply Ability: 1, 000, 000 PCS / week
Delivery Time: 5-10 days
Packaging Details: inner: vacuum-packed bubble bag outer: carton box
Base material: FR4
Board thickness: 1.6mm
Surface finish: Immersion gold
Layer: 24
Silkscreen: White
Soldermask: Green
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FR4 High TG F4B HDI 94v0 High Frequency PCB HDI Immersion Gold Board High Density Interconnect

HDI High TG 24 multilayer immerison gold Inner 0.5oz outer 1oz PCB board


Material:FR4Soldermask:Green
Molde Number:xcepcb0011Silkscreen:White
Layer:24Panel Size:75*105mm
Board Thickness:1.6mm

Package Details:

Inner:Vacuum-packed

Bubble bag

With Foam

Outer:Carton Box

Min Line Space:4Mil
Min Line Width:4Mil
Min Hole Size:12Mil
Finished Surface:ENIG

Special requirement:

Provide Slice report

Provide shipment report

Finished Copper:1oz
Delivery Time:8 Days

Parameter


Profile tolerance±0.10mm(4mil)c
Board bend&warp≤0.7%
Insulation resistance>1012Ωnormal
Through-hole resistance<300Ωnormal
Electric strength>1.3kv/mm
Current breakdown10A
Peel strength1.4N/mm
Soldmask regidity>6H
Thermal stress288℃20Sec
Testing voltage50-300v
Min buried blind via0.2mm(8mil)
Outer cooper thickness1oz-5oz
Inner cooper thickness1/2 oz-4oz
Aspect ratio8:1
SMT min green oil width0.08mm
Min green oil open window0.05mm
Insulation layer thickness0.075mm-5mm
Aperture0.2mm-0.6mm
Special technologyInpedance,blind buried via,thick gold,aluminumPCB
Surface finishHASL,lead free,Immersion gold,immersion tin,immersion silver,ENIG,Blue glue,gold plating

Laminate
Technology IndexMass productionMiddle and Small VolumePrototype
FR4Normal TgS1141 (Not Recommander for HF )
Middle TgS1000H(HDI, Mul-layer Board))
High TgS1000-2M, IT180A(Heavy Copper, Multi-Layer Board)
Halogen FreeMiddle TgS1150g
High Tgs1165
Ceramics Filled High Frequency BoardRogers series,Arlon Series,Toconic Series,Taizhou Lin Wang
Special PPLow Flow PP, Arlon 49N
Ceramic Filled, Rogers4450, Arlon25FR
PTFE PP, Arlon 6700,Taconic FR-27
Rigid PIArlon 85N,Shenyi SH260
Metal-SubstrateBercquist AL Substrate, Copper Substrate
Pure Ceramics MaterialN/A
Note: For other material not involed, We can purchase or help to purchase for customers special requirements.

Technology IndexMass productionMiddle and Small VolumePrototype
LayerFR4 Series202836
Rigid Flex/Flex6(4)10(8)16(12)
High Frequency Hibrid Laminate121824
Pure PEFE4812
Metal Core244

Some more case:


About us:


Xinchenger, have commited to manufacturing various of hi-frequency microwave pcb and multi-layer board including fastest sample production. we have accumulated abandunt experiences in the line of high frequency microwave business for which widely apply to power divider,combiner,power amplifier,line amplifier,base station.


Our advantage:


1, The industry’s top materials business High TG, FR4, high frequency(Rogers,Teflon, ARLON, TYCONIC),Long-term cooperation.

2, Advanced technology


min/T/G:3/3 mil
min CMC hole: 0.15mm
min line width: 5um(3um available)
MAX aspect ratio for board thickness vs drill bit size 15:1


3, Our unique one stop solution to all printed circuit needs, PCB &PCBA assembly service and component procument


4, Quality control:

AOI Testing

X-Ray Inspection

In-Circuit Testing

Quality FR4 High TG F4B HDI 94v0 High Frequency PCB HDI Immersion Gold Board High Density Interconnect for sale
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