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| Categories | Waffle Pack Chip Trays |
|---|---|
| Place of Origin: | China |
| Clean Class: | General And Ultrasonic Cleaning |
| Tray Shape: | Rectangular |
| Model Number: | HN24175 |
| Supply Ability: | 2000PCS/Day |
| Mold Type: | Injection |
| Reusable: | Yes |
| Tray Weight: | Varies, Typically Up To 500 Grams Per Cavity |
| Delivery Time: | 10 workdays |
| Packaging Details: | CARTON, PALLET |
| Ic Type: | BGA,QFP,QFN,LGA,PGA |
| Incoterms: | EXW, FOB, CIF, DDU, DDP |
| Brand Name: | Hiner-pack |
| Payment Terms: | T/T |
| Outline Line Size: | 50.7×50.7×7.4 mm |
| Cavity Size: | 1.30x1.15x0.72 mm |
| Warpage: | Warpage MAX 0.2mm |
| Capacity: | 17x18=306 PCS |
| Price: | $1.35~$2.68(Prices Are Determined According To Different Incoterms And Quantities） |
| Quality Assurance: | Delivery Guarantee, Reliable Quality |
| Certification: | ROHS, ISO |
| MOQ: | 1000 |
| Packing Level: | Transport package |
| Color: | Black |
| Company Info. |
| Shenzhen Hiner Technology Co., Ltd. |
| Verified Supplier |
| View Contact Details |
| Product List |
This tray provides reliable ESD protection for IC chips. It prevents static damage and contamination during handling. Its cross-slot structure holds components securely.
It fits semiconductor testing, die sorting, and packaging processes. It works well in cleanroom and automated production environments. It withstands high temperatures up to 125℃.
It supports IC chip turnover, storage, and logistics. It offers customizable cavity sizes and layouts. Tailored designs meet diverse semiconductor packaging needs.
| Brand | Hiner-pack | ||
| Color | Black | ||
| Outline Line Size | 50.7×50.7×7.4 mm | ||
| Matrix QTY | 17x18=306 PCS | ||
| Service | Accept OEM, ODM | ||
It supports chip internal turnover, long-term storage, and logistics. It meets various integrated circuit processing and assembly requirements.
Why Choose Us:
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