bt csp package substrate

Brand Name:Loranger

Model Number:Ball Grid Array (BGA)/Chip Scale Package (CSP) Sockets

...Package Height Variations Non-Magnetic Socket Options Available Accurate, Tightly-controlled Package Fit Contacts Connect Solder ball to Board Pad Optional Heat Sink Item # Item Name Package Name Number of Input/Output (I/O) Pitch 006004006J6617 6 Input/Output (I/O) and 0.23/0.22 Millimeter (mm) Pitch Ball Grid Array (BGA)/Chip Scale Package (CSP) Socket BGA/CSP...

Brand Name:Original Factory

Model Number:ATS300X

Place of Origin:CN

BT IC ATS300X TWS True Wireless BT 5.0 Chip ATS300 Low Power QFN32 Package Product Description ATS300X series is a high-quality BT 5.0 chip, which is a new generation of BT headset products launched by Actions. It is small in size, multi-functional, and...

Brand Name:Original Factory

Model Number:BM23SPKS1NB9-0B02AA

Place of Origin:CN

BT IC BM23SPKS1NB9-0B02AA BT Transceiver Module 2.4GHz Integrated Surface Mount Product Description Of BM23SPKS1NB9-0B02AA BM23SPKS1NB9-0B02AA BT SIG-certified module provides a complete wireless solution with BT stack,integrated antenna, and worldwide radio certifications in a compact surface mount package...

Brand Name:Original Factory

Model Number:BLUENRG-345VC

Place of Origin:CN

BT IC BLUENRG-345VC Programmable BT Low Energy wireless SoC 2.4GHz 49-XFBGA Product Description Of BLUENRG-345VC BLUENRG-345VC is an ultra-low power programmable BT Low Energy wireless SoC solution.Support for external PA. Specification Of BLUENRG-345VC Part Number BLUENRG-345VC Current - Transmitting 4.3mA Operating Temperature -40°C ~ 85°C (TA) Mounting Type Surface Mount Package / Case 49-XFBGA, WLCSP Features Of BT...

Brand Name:Original Factory

Model Number:AD6976D

Place of Origin:CN

...BT Audio SoC QFN32 BT IC​ Product Description Of AD6976D AD6976D is a highly integrated, low-power BT audio SoC supporting 24/48KHz audio with built-in buck and regulator circuits for powering internal digital and analogue circuits. It is available in 4x4mm QFN32 package. Features Of AD6976D Supports BT...

Brand Name:Phenson

Model Number:PS-E9

Place of Origin:Guangzhou

...±0.3A Color 6000K pure white Working temperature -40-160℃ Lifespan >20000 hrs LED source 3570 CSP Packaging & Shipping - In order to protect the goods during transportation, carton and weaving bag are provided according to your requirement. -

Brand Name:Phenson

Model Number:PS-E9

Place of Origin:Guangzhou

...±0.3A Color 6000K pure white Working temperature -40-160℃ Lifespan >20000 hrs LED source 3570 CSP Packaging & Shipping - In order to protect the goods during transportation, carton and weaving bag are provided according to your requirement. -

Brand Name:LEARNEW

Model Number:4055 SERIES

Place of Origin:China

72-74V Dual Color COB LED Customized 300W 4055 Dual Color COB LED White 2600K+6500K COB LED CHIP Product Details Model POWER CCT LM/W IF VF WHOLE SIZE EMIT SIZE VIEW ANGLE CRI SUBSTRATE 4055 SERIES 300W+300WDual Color Temperature 2700K/6500K 90/120 3.9A ...

Brand Name:Original Factory

Model Number:NRF52811-CAAA-R

Place of Origin:CN

...h two QFN packages. It is drop-in compatible with the nRF52810 SoC in all package variants: 6x6 mm QFN48 with 32 GPIOs 5x5 mm QFN32 with 17 GPIOs 2.48x2.46 mm WLCSP32 with ...

Brand Name:Original Factory

Model Number:EFR32BG22C222F352GM40-C

Place of Origin:CN

... energy-friendly BT 5.2 networking for IoT devices.The single-die solution combines a 76.8 MHz Cortex-M33 with a high performance 2.4GHz radio to ...

Brand Name:Original Factory

Model Number:EFR32BG22C224F512GM40-C

Place of Origin:CN

BT IC EFR32BG22C224F512GM40-C RF System on a Chip - SoC Blue Gecko QFN40 Package Product Description Of EFR32BG22C224F512GM40-C The EFR32BG22C224F512GM40-C is part of the Wireless Gecko portfolio. EFR32BG22C224F512GM40-C is ideal for enabling energy-friendly BT...

Brand Name:Original Factory

Model Number:BLUENRG-355VC

Place of Origin:CN

BT IC BLUENRG-355VC 2.4GHz 49-XFBGA Package Programmable RF Transceiver ICs Product Description Of BLUENRG-355VC BLUENRG-355VC is also suitable for 2.4 GHz proprietary radio wireless communication to address ultra-low latency applications. Specification Of BLUENRG-355VC Part Number BLUENRG-355VC Data Bus Width: 32 bit Data RAM Size: 64 kB Data RAM Type: RAM Height: 0.9 mm Features Of BT...

Brand Name:Original Factory

Model Number:QCC-3020-0-CSP90-TR-00-0

Place of Origin:CN

... architecture which has been designed for use in compact feature optimized TrueWireless™ Stereo earbuds. The QCC3020 is available in a VFBGA package with support for aptX™ audio and is designed to provide our customers with a solution that helps to

Brand Name:Original Factory

Model Number:AB1568A

Place of Origin:CN

QFN package AB1568A BT 5.2 dual mode Noise canceling BT headset chip Product Description AB1568A is a support TWS BT version 5.2, low power consumption, low latency, but also an open BT headset chip. Compared with 153X series, it improves the sound quality...

Brand Name:Original Factory

Model Number:RN4870-I/RM140

Place of Origin:CN

...data through Transparent UART in the BLE mode and through SPP in BT Classic mode. Specification Of RN4870-I/RM140 Part Number: RN4870-I/RM140 Operating Temperature: -20°C ~ 70°C Package: Module Product Status: Active Antenna: Chip Subcategory: Wireless &

Brand Name:wuxi special ceramic

Place of Origin:China

... ceramic. It is widely used in electronic devices and components due to its excellent thermal properties. Our Ceramics substrate is produced in Jiangsu, China, ensuring high quality and reliability. It is available in a standard size of 10x10mm, making it

Brand Name:Horexs

Place of Origin:china

... represented by the ball grid array packaging chip size packaging came out,IC carrier as a new packaging carrier came into being IC board is developed on the basis of HDI board, as a high-end PCB board, with high density, high ...

Brand Name:Horexs

Model Number:SC-01

Place of Origin:china

...Substrate pcb Above IC substrate is a type of memory chip ic package substrate,Which is widely use for memory card,High tg FR4 (170tg),ENIG gold wire bonding substrate. Application: ​Memory electronics MicroSD TF card IC Package,Semiconductors electronics Semiconductor IC package...

Brand Name:ZMSH

Place of Origin:China

Product Overview TGV (Through Glass Via) technology, also known as glass through-hole technology, is a vertical electrical interconnection technique that penetrates glass substrates. It enables vertical electrical connections on glass substrates, achieving...

Brand Name:Horexs

Place of Origin:china

...,the IC substrate can protect the circuit, special line, it is designed for heat dissipation and acts standardized module of IC components. It is one of the most key materials of the memory IC packaging, and the share of IC substrate. Application: