mechanism ball grid array socket

Brand Name:HSTECH

Model Number:HS-620

Place of Origin:China

... used in the electronics manufacturing and repair industry to rework or replace Ball Grid Array (BGA) components on printed circuit boards (PCBs). BGA components are commonly used due to their high density and performance, but they can be challenging...

Brand Name:HSTECH

Model Number:HS-520

Place of Origin:China

... is a specialized tool used in the electronics manufacturing industry to repair or replace Ball Grid Array (BGA) components on printed circuit boards (PCBs). These components are popular due to their high density and performance but can be challenging to work wit...

Brand Name:HSTECH

Model Number:HS-520

Place of Origin:China

... is a specialized tool used in electronics manufacturing and repair to manage the rework and repair of Ball Grid Array (BGA) components on printed circuit boards (PCBs). These stations are essential for tasks such as replacing faulty BGA chips, soldering new...

Brand Name:HSTECH

Model Number:HS-700

Place of Origin:China

...a specialized piece of equipment designed for repairing and reworking Ball Grid Array (BGA) components on mobile phone circuit boards. These stations are crucial in the electronics repair industry, especially for repairing smartphones and other portable ...

Brand Name:HSTECH

Model Number:HS-800

Place of Origin:China

... Assembly​ Introduction: A BGA Rework Station is specialized equipment used for the repair and rework of Ball Grid Array (BGA) components on printed circuit boards (PCBs). These stations are essential in electronics manufacturing and repair, allowing ...

Brand Name:Original Factory

Model Number:MIMX8DX1AVOFZAC

Place of Origin:CN

... i.MX 8DualXPlus FBGA417 Applications Processors​ Product Description Of MIMX8DX1AVOFZAC MIMX8DX1AVOFZAC fine-pitch ball grid array package, 417 terminals, 0.8 mm pitch, i.MX 8DualXPlus Applications Processors​. Specification Of MIMX8DX1AVOFZAC...

Brand Name:Original Factory

Model Number:MIMX8ML6CVNKZAB

Place of Origin:CN

...MIMX8ML6CVNKZAB MIMX8ML6CVNKZAB is i.MX 8M Plus Quad Microprocessor Chip, low profile, fine-pitch, ball grid array package, 548 terminals, 0.5 mm pitch. Specification Of MIMX8ML6CVNKZAB Part Number: MIMX8ML6CVNKZAB Core Type: 4 X Arm Cortex-A53 Operating ...

Brand Name:Original Factory

Model Number:MIMX8MN5DVPIZAA

Place of Origin:CN

...MIMX8MN5DVPIZAA MIMX8MN5DVPIZAA is i.MX 8M Nano UltraLite Quad Microprocessors IC, thin ball grid array package, 306 terminals, the package is 306-TFBGA (11x11). Specification Of MIMX8MN5DVPIZAA Part Number MIMX8MN5DVPIZAA USB Controllers 1 Serial...

Brand Name:Original Factory

Model Number:MIMX8MN5CVPIZAA

Place of Origin:CN

... MCU 1.4GHz MIMX8MN5CVPIZAA TBGA306 4 Core Microprocessors IC​ Product Description Of MIMX8MN5CVPIZAA MIMX8MN5CVPIZAA TBGA306, thin ball grid array package, 306 terminals, i.MX 8M Nano UltraLite Quad Applications Processors. 1x Gigabit Ethernet...

Brand Name:Original Factory

Model Number:MIMX8MN1DVTJZAA

Place of Origin:CN

... Real-time integrity checker (RTIC), i.MX 8M Nano SoloLite. The package is LFBGA486, low profile fine-pitch ball grid array. Specification Of MIMX8MN1DVTJZAA Part Number MIMX8MN1DVTJZAA Video/Display features MIPI-CSI,MIPI-DSI Audio Specific Modules 8-ch ...

Brand Name:Original Factory

Model Number:MCIMX7S3DVK08SD

Place of Origin:CN

...®-A7 and Cortex-M4 Cores. Package is TFBGA488, plastic, thin fine-pitch ball grid array. Specification Of MCIMX7S3DVK08SD Part Number MCIMX7S3DVK08SD USB USB 2.0 + PHY (1), USB 2.0 OTG + PHY (1) Voltage - I/O 1.8V, 3.3V Operating Temperature 0°C ~ ...

Brand Name:Original Factory

Model Number:MCIMX7U3CVP06SD

Place of Origin:CN

...-power. The package is LFBGA393, low profile fine-pitch ball grid array. Specification Of MCIMX7U3CVP06SD Part Number: MCIMX7U3CVP06SD Number Of Cores/Bus Width: 1 Core, 32-Bit Operating Frequency(Max): 650MHz ...

Brand Name:Original Factory

Model Number:LS1027AXE7PQA

Place of Origin:CN

... enabled. Package is FBGA448, fine-pitch ball grid array package. Product Attributes Of LS1027AXE7PQA Part Number: LS1027AXE7PQA Qualification Tier: Industrial Core Type Arm: Cortex-A72 Number Of ...

Brand Name:Original Factory

Model Number:LS1017ASN7PQA

Place of Origin:CN

...Description Of LS1017ASN7PQA LS1017ASN7PQA is Single Core 1.5GHz​ Processors Chip, FBGA448, fine-pitch ball grid array package. Two high-speed USB 2.0/3.0 controllers with integrated PHY. Product Attributes Of LS1017ASN7PQA Part Number: LS1017ASN7PQA Timers: 8 ...

Brand Name:Original Factory

Model Number:AQC113-B1-C

Place of Origin:CN

..., Single-port Size: 12 Mm X 14 Mm Pitch: 0.8 Mm Pitch Package: 224-pin, Flip-chip Ball Grid Array (FCBGA)

Brand Name:Micron Technology Inc.

Model Number:MT47H64M16HR-25E:H

Place of Origin:original

...t is ideal for a variety of applications. It features a 16M x 16-bit configuration and is available in a 204-pin ball grid array package. It is capable of supporting up to 400 MHz clock speeds and offers high-speed data transfer rates of up to 800 Mbps.

Brand Name:Micron Technology Inc.

Model Number:MT40A256M16LY-062E:F

Place of Origin:Multi-origin

MT40A256M16LY-062E:F Flash Memory Chips Product Specifications: • Capacity: 256Mb (16M x 16) • Package: Ball Grid Array (BGA) • Temperature Range: Standard (0°C to +70°C) • Interface: DDR2 • Memory Organization: x16 • Number of Bank Bits...

Brand Name:Intel

Model Number:EP1C6Q240I7N

Place of Origin:Multi-origin

EP1C6Q240I7N Programmable IC Chip Product Parameters: • Operating Voltage: 3.3V • Maximum Clock Frequency: 66 MHz • Programmable I/O Pins: 240 • Package: Ball Grid Array • Number of Configurable Logic Cells: 8,192 • Maximum Operating Temperature: 85°C • ...

Brand Name:Intel

Model Number:EP1C4F400C8N

Place of Origin:Multi-origin

... IC Chip Parameters: - Number of Logic Cells: 4,400 - Speed: 133 MHz - Package: 144-Pin Fine Pitch Ball Grid Array - Voltage Supply Range: 1.14V - 1.26V - Maximum Power Consumption: 4.8W - Number of I/O Pins: 144 - Operating Temperature: -40°C to +...

Brand Name:Intel

Model Number:EP1C12F324I7N

Place of Origin:Multi-origin

Product Listing: EP1C12F324I7N Programmable IC Chip Description: EP1C12F324I7N is a programmable integrated circuit (IC) chip manufactured by Altera. It features 324-pin, plastic ball grid array (BGA) package, and is suitable for applications such as ...